Method for manufacturing circuit devices

Details Method for manufacturing circuit devices Method for manufacturing circuit devices

2007-01-16

2007-01-16

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C257SE21502

Reexamination Certificate

active

10667681

ABSTRACT:
In order to prevent, in a resin sealing step, a conductive foil10from locally rising because of concentration of air intervening between the conductive foil10and lower mold28A due to the charged pressure, a method for manufacturing circuit devices is provided. The method for manufacturing circuit devices includes the step of forming conductive patterns21, which form a plurality of mounting portions15of a circuit element22on a conductive foil10, in each block12, the step of disposing the circuit element22on each mounting portion15of the conductive pattern21in each block12, the step of performing resin sealing by bringing the lower mold28A having an air vent30into contact with the backface of the conductive foil10in each block12and by performing transfer molding with an insulating resin20while disposing each mounting portion15of the block12in the same cavity, and the step of separating each mounting portion15by dicing.

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