Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate
2007-01-16
2007-01-16
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
C257SE21502
Reexamination Certificate
active
10667681
ABSTRACT:
In order to prevent, in a resin sealing step, a conductive foil10from locally rising because of concentration of air intervening between the conductive foil10and lower mold28A due to the charged pressure, a method for manufacturing circuit devices is provided. The method for manufacturing circuit devices includes the step of forming conductive patterns21, which form a plurality of mounting portions15of a circuit element22on a conductive foil10, in each block12, the step of disposing the circuit element22on each mounting portion15of the conductive pattern21in each block12, the step of performing resin sealing by bringing the lower mold28A having an air vent30into contact with the backface of the conductive foil10in each block12and by performing transfer molding with an insulating resin20while disposing each mounting portion15of the block12in the same cavity, and the step of separating each mounting portion15by dicing.
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Igarashi Yusuke
Noguchi Masato
Sakai Noriyasu
Fish & Richardson P.C.
Geyer Scott B.
Sanyo Electric Co,. Ltd.
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