Plastic and nonmetallic article shaping or treating: processes – With severing – removing material from preform mechanically,... – Making hole or aperture in article
Reexamination Certificate
2006-04-04
2006-04-04
Colaianni, Michael P. (Department: 1732)
Plastic and nonmetallic article shaping or treating: processes
With severing, removing material from preform mechanically,...
Making hole or aperture in article
C264S236000, C264S346000, C156S308200, C156S307500
Reexamination Certificate
active
07022276
ABSTRACT:
A method for manufacturing a circuit board with high thermal dissipation includes the following steps: preparing a thermal conductive resin composition including 70 to 95 mass % of an inorganic filler and 5 to 30 mass % of a resin composition that includes a liquid thermosetting resin, a thermoplastic resin powder, and a latent curing agent; bonding the thermal conductive resin composition and a metal foil together by heating at a temperature lower than a temperature at which the thermosetting resin starts to cure while applying pressure so that the thermal conductive resin composition increases in viscosity and thus is solidified irreversibly; providing holes and curing the thermosetting resin to form an insulating substrate; and forming through holes and a circuit pattern. This method can achieve improved productivity and low cost in processing the holes. It is preferable that the thermal conductive resin composition is integral with a reinforcing material.
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Hirano Koichi
Nakatani Seiichi
Yamashita Yoshihisa
Colaianni Michael P.
Fontaine Monica A.
Hamre Schumann Mueller & Larson P.C.
Matsushita Electric - Industrial Co., Ltd.
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