Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1998-01-09
2000-04-11
Mayes, Curtis
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156 8912, 156252, 29851, B32B 3126
Patent
active
060484241
ABSTRACT:
Via portions are formed in a first green sheet for a first layer of a laminated substrate. Then, conductive lands are formed on a surface of the first green sheet and a wiring pattern is formed on a back face of the first green sheet to be connected to the conductive lands through the via portions. The thus formed first green sheet is joined to a second green sheet having via portions therein so that the wiring pattern of the first green sheet contacts the via portions of the second green sheet. In this case, by forming the wiring pattern on the back face of the first green sheet, lamination slippage of the wiring pattern caused by lamination of the first and second green sheets can be prevented.
REFERENCES:
patent: 3922777 (1975-12-01), Weitze et al.
patent: 5292574 (1994-03-01), Kata et al.
patent: 5383093 (1995-01-01), Nagasaka
patent: 5439732 (1995-08-01), Nagasaka et al.
patent: 5456778 (1995-10-01), Fukuta et al.
patent: 5554806 (1996-09-01), Mizuno et al.
patent: 5562973 (1996-10-01), Nagasaka et al.
patent: 5601672 (1997-02-01), Casy et al.
patent: 5757611 (1998-05-01), Gurkovich et al.
Journal of Nippondenso Technical Disclosure, No. 45-158, 1986.
Journal of Nippondenso Technical Disclosure, No. 54-184, 1987.
Asai Yasutomi
Gohara Kenichi
Nagasaka Takashi
Shimojo Yoshiaki
Yamasaki Takashi
Denso Corporation
Mayes Curtis
LandOfFree
Method for manufacturing ceramic laminated substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing ceramic laminated substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing ceramic laminated substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1173887