Method for manufacturing built-up printed circuit board with...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S830000, C029S831000, C029S846000, C029S847000, C029S853000, C174S257000, C174S258000, C174S259000, C174S264000, C427S097200

Reexamination Certificate

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07152318

ABSTRACT:
A built-up printed circuit board includes stacked micro via-holes, each of which is provided for interconnection between layers in the printed circuit board, and in each of which a filling material, such as liquefied resin or conductive paste, is filled using a poly screen of a general screen printing machine.

REFERENCES:
patent: 5883335 (1999-03-01), Mizumoto et al.
patent: 5956843 (1999-09-01), Mizumoto et al.
patent: 6240636 (2001-06-01), Asai et al.
patent: 6660811 (2003-12-01), Ogura et al.

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