Method for manufacturing bonded wafer and outer-peripheral...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate

Reexamination Certificate

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Details

C257SE21088

Reexamination Certificate

active

07727860

ABSTRACT:
The present invention provides a method for manufacturing a bonded wafer, which includes at least the steps of bonding a bond wafer and a base wafer, grinding an outer peripheral portion of the bonded bond wafer, etching off an unbonded portion of the ground bond wafer, and then reducing a thickness of the bond wafer, wherein, in the step of grinding the outer peripheral portion, the bonded bond wafer is ground so as to form a groove along the outer peripheral portion of the bond wafer to form an outer edge portion outside the groove; and in the subsequent step of etching, the outer edge portion is removed together with the groove portion of the bond wafer to form a terrace portion where the base wafer is exposed at the outer peripheral portion of the bonded wafer. Thus, it is possible to provide a method for manufacturing a bonded wafer, which can reduce the number of dimples formed in a terrace portion of a base wafer upon removing an outer peripheral portion of a bonded bond wafer.

REFERENCES:
patent: 3708291 (1973-01-01), Cronkhite et al.
patent: 3708921 (1973-01-01), Cronkhite et al.
patent: 4662124 (1987-05-01), Kato et al.
patent: 6291315 (2001-09-01), Nakayama et al.
patent: 6645297 (2003-11-01), Suzuki et al.
patent: 7242444 (2007-07-01), Kamijima et al.
patent: 2001/0016423 (2001-08-01), Sakamoto
patent: 2003/0102530 (2003-06-01), Matsumoto et al.
patent: 2007/0072393 (2007-03-01), Aspar et al.
patent: A-07-099295 (1995-04-01), None
patent: A-10-083986 (1998-03-01), None
patent: A-2000-091175 (2000-03-01), None
patent: A-2000-223452 (2000-08-01), None

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