Method for manufacturing and handling thin wafers

Details Method for manufacturing and handling thin wafers Method for manufacturing and handling thin wafers

1989-07-31

1990-11-06

Rosenbaum, Mark

Metal working

Method of mechanical manufacture

Obtaining plural product pieces from unitary workpiece

294264, B23P 1904

Patent

active

049674617

ABSTRACT:
Method and apparatus for manufacturing thin wafers from bars, such as in the manufacture of wafers for use as semiconductor substrates, include an arrangement wherein a holder member is fastened to the bar, the bar is sliced to separate a disc-shaped wafer therefrom and wherein prior to completion of the slicing operation, the end face of the bar is leveled to a precisely planar condition. The slicing operation is terminated after the bar is sliced completely through and the holder member is partially, but not completely, sliced through so that a wafer formed by the slicing operation remains connected to the bar by the holder member. The wafer is disconnected from the bar by abrading a portion of the holder member connecting the wafer to the bar.

REFERENCES:
patent: 2382257 (1945-08-01), Ransay
patent: 3828758 (1974-08-01), Cary
patent: 4227348 (1980-10-01), Demers
patent: 4228782 (1980-10-01), Demers et al.
patent: 4420909 (1983-12-01), Steere, Jr.
patent: 4663890 (1987-05-01), Brandt

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