Method for manufacturing an overmolded sensor

Details Method for manufacturing an overmolded sensor Method for manufacturing an overmolded sensor

1995-03-17

1996-12-31

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29593, 29841, 29856, 361760, 174 522, H01F 706

Patent

active

055882021

ABSTRACT:
A method is described for manufacturing a plurality of proximity sensors which are attached to a printed circuit board during the manufacturing steps and subsequently severed from the printed circuit board by shearing. Each of the proximity sensors comprises a core and coil assembly, a plurality of electronic components and an electrical connector. These components of each of the proximity sensors is encapsulated during an overmolding process and the encapsulations are removed from the printed circuit board by a shearing step. Each of the encapsulations can be inserted into a cylindrical housing.

REFERENCES:
patent: 3409856 (1968-11-01), Meoni
patent: 3714709 (1973-02-01), Liederbach
patent: 3996510 (1976-12-01), Guichard
patent: 4134091 (1979-01-01), Rogers
patent: 5121289 (1992-06-01), Gagliandi
patent: 5349500 (1994-09-01), Casson et al.
patent: 5364707 (1994-11-01), Swinhen

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