Semiconductor device manufacturing: process – Having organic semiconductive component
Reexamination Certificate
2004-12-15
2010-02-09
Le, Dung A. (Department: 2818)
Semiconductor device manufacturing: process
Having organic semiconductive component
C438S082000, C257S040000
Reexamination Certificate
active
07659138
ABSTRACT:
In manufacturing a device using an organic TFT, it is essential to develop an element in which a channel length is short or a channel width is narrow to downsize a device. Based on the above, it is an object of the present invention to provide an organic TFT in which characteristic is improved. In view of the foregoing problem, one feature of the present invention is that an element is baked after an organic semiconductor film is deposited. More specifically, one feature of the present invention is that the organic semiconductor film is heated under atmospheric pressure or under reduced pressure. Moreover, a baking process may be carried out in an inert gas atmosphere.
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Notice on First Office Action dated Nov. 28, 2008 in Chinese Patent Application No. 200410011448.X, People's Republic of China, 7 pages; with English translation, 12 pp.
Fukai Shuji
Hirakata Yoshiharu
Imahayashi Ryota
Ishitani Tetsuji
Costellia Jeffrey L.
Le Dung A.
Nixon & Peabody LLP
Semiconductor Energy Laboratory Co,. Ltd.
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