Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1993-09-01
1997-02-11
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
1562722, 1566431, 156 89, 427123, 347123, B32B 3114
Patent
active
056016840
ABSTRACT:
A method for manufacturing an ion flow electrostatic recording head including: a plurality of first electrodes extending in parallel to one another on an insulating substrate; a plurality of second electrodes intersecting the plurality of first electrodes to form a matrix and having openings at positions corresponding intersections of the matrix; and a dielectric layer interposed between the plurality of first and second electrodes. The plurality of the first and second electrodes jointly constitute ion generating portions arranged in a matrix pattern. The method includes: (a) forming a conductive film on the dielectric layer which constitutes a multilayer structure on the insulating substrate together with the first electrodes; and applying a plating to the conductive film to form the plurality of second electrodes, the plating including applying a nickel chemical plating to the conductive film and applying an electroless plating thereto.
REFERENCES:
patent: 4241103 (1980-12-01), Ohkubo et al.
patent: 4622240 (1986-11-01), Yext et al.
patent: 4820547 (1989-04-01), Lindsay et al.
patent: 4958172 (1990-09-01), McCallum et al.
patent: 5403650 (1995-04-01), Baudrand et al.
Mayes M. Curtis
Olympus Optical Co,. Ltd.
Simmons David A.
LandOfFree
Method for manufacturing an ion flow electrostatic recording hea does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing an ion flow electrostatic recording hea, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing an ion flow electrostatic recording hea will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-338903