Method for manufacturing an insulated gate semiconductor device

Fishing – trapping – and vermin destroying

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437 44, 437 41, 437 45, 437 27, H01L 21265

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055455751

ABSTRACT:
Insulated gate semiconductor device (10) and a method of manufacturing the insulated gate semiconductor device (10). The insulated gate semiconductor device (10) includes an N-channel transistor (15) and a P-channel transistor (16). The N-channel transistor (15) has a gate electrode (35) that has a central portion (28) and two adjacent gate extensions (49, 52). Likewise the P-channel transistor (16) has a gate electrode (35') which has a central portion (29) and two adjacent gate extensions (53, 54). The gate extensions (49, 52, 53, 54) allow the formation of graded channel regions underneath the gate electrodes (35, 35') and adjacent to the source (57, 59) and drain (58, 62) regions by offsetting an LDD or a single heavily doped source/drain implant from channel regions which are covered by the gate extensions (49, 52 53, 54).

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Codella, C. F. et al., "Submicron IGFET Device With Double Implanted Lightly Doped Drain/Source Structure", IBM Technical Disclosure Bulletin, vol. 26, No. 12, May 1984, pp. 6584-6586.

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