Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1976-02-24
1977-07-05
Lesmes, George F.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156 53, 156283, 156330, 174110E, 427203, 427204, 428324, 428454, B32B 1904, B32B 3112, H01B 1308
Patent
active
040338053
ABSTRACT:
A compound mica sheet is prepared by bonding a mica sheet to a woven fabric through a powdered epoxy resin with curing agent. The mica sheet holds a cured thermosetting resin composition impregnated therein and has an uncured epoxy resin composition including a curing agent impregnated therein. When thermosetting resin is forcedly impregnated, through vacuum/pressure impregnation, into a coil wound with the compound mica sheet which is adapted for use in medium and high voltage electric apparatus, and then cured, an excellent insulated coil is obtained.
REFERENCES:
patent: 2917570 (1959-12-01), Wolff et al.
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patent: 3470045 (1969-09-01), Bronnvall et al.
patent: 3592711 (1971-07-01), Senarelens et al.
patent: 3618753 (1974-11-01), Glasspoole
patent: 3740289 (1973-06-01), VON Alten et al.
patent: 3811005 (1974-05-01), Trunzo et al.
Kamiuchi Jun-ichi
Kumazawa Ryozi
Mitsui Hisayasu
Takechi Taichi
Umemoto Kimikazu
Lesmes George F.
Roche R. J.
Tokyo Shibaura Electric Co. Ltd.
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