Method for manufacturing an image sensor

Details Method for manufacturing an image sensor Method for manufacturing an image sensor

2007-07-31

2007-07-31

Wilczewski, M. (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S115000, C438S116000, C438S118000, C438S123000

Reexamination Certificate

active

10386067

ABSTRACT:
A method for manufacturing an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer on the upper surface of the substrate to form a cavity together with the substrate; mounting a photosensitive chip, which is formed with a plurality of bonding pads, to the upper surface of the substrate, the photosensitive chip being located within the cavity; providing a plurality of wires to electrically connect the bonding pads of the photosensitive chip to the substrate; supplying an adhesive medium to the cavity; placing a transparent layer on the frame layer to cover the photosensitive chip so as to form the image sensor; and rotating the image sensor to make the adhesive medium be uniformly distributed over the upper surface of the substrate so that particles within the cavity are adhered to the adhesive medium.

REFERENCES:
patent: 5714222 (1998-02-01), Yokoyama
patent: 6403881 (2002-06-01), Hughes
patent: 6753203 (2004-06-01), Dai
patent: 6841412 (2005-01-01), Fisher et al.

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