Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2003-05-28
2004-06-22
Tsai, H. Jey (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S115000, C438S116000
Reexamination Certificate
active
06753203
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to a method for manufacturing an image sensor, and in particular to a method capable of manufacturing an image sensor having fewer particles on a photosensitive chip or a transparent layer and having improved quality.
2. Description of the Related Art
A general sensor is used to sense signals, which may be optical or audio signals. The sensor of the invention is used to receive image signals or optical signals. After receiving the image signals, the sensor converts the image signals into electrical signals, which are then transmitted to a printed circuit board via a substrate.
Referring to
FIG. 1
, a conventional image sensor includes a substrate
10
, a frame layer
18
, a photosensitive chip
26
, a plurality of wires
28
, and a transparent layer
34
. The substrate
10
has an upper surface
12
on which first connection points
15
are formed, and a lower surface
14
on which second connection points
16
are formed. The frame layer
18
has a first surface
20
and a second surface
22
adhered to the upper surface
12
of the substrate
10
to form a cavity
24
together with the substrate
10
. The photosensitive chip
26
is arranged within the cavity
24
and is mounted to the upper surface
12
of the substrate
10
. Each wire
28
has a first terminal
30
and a second terminal
32
. The first terminals
30
are electrically connected to the photosensitive chip
26
, and the second terminals
32
are electrically connected to the first connection points
15
of the substrate
10
. The transparent layer
34
is adhered to the first surface
20
of the frame layer
18
.
In the image sensor, however, even if the transparent layer
34
and the photosensitive chip
26
are cleaned before the packaging process, some particles may be attracted to the transparent layer
34
and the photosensitive chip
26
owing to electrostatic charges, and the image sensor quality may be influenced accordingly.
SUMMARY OF THE INVENTION
An object of the invention is to provide a method for packaging an image sensor capable of eliminating electrostatic charges within the image sensor and preventing particles from being attracted to the photosensitive chip.
Another object of the invention is to provide a method for manufacturing an image sensor capable of adhering particles to an adhesive layer without influencing the image sensor quality.
To achieve the above-mentioned objects, the invention provides a method for manufacturing an image sensor including the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer to the upper surface of the substrate to form a cavity together with the substrate; mounting a photosensitive chip to the upper surface of the substrate and within the cavity; providing a plurality of wires to electrically connect the photosensitive chip to the substrate; supplying an adhesive layer to the upper surface of the substrate and within the cavity; mounting a transparent layer to the frame layer to cover the photosensitive chip; and illuminating an electrostatic-charge eliminating light source on the transparent layer to let particles within the cavity fall down to the adhesive layer.
Consequently, the particles may fall down to the adhesive layer, and it is possible to prevent the particles from being attracted to the photosensitive chip or the transparent layer and to prevent the particles from influencing the image sensor quality.
REFERENCES:
patent: 4426769 (1984-01-01), Grabbe
Kingpak Technology Inc.
Pro-Techtor Inter-national Services
Tsai H. Jey
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