Method for manufacturing an endovascular support device

Details Method for manufacturing an endovascular support device Method for manufacturing an endovascular support device

2005-03-08

2005-03-08

Bryant, David P. (Department: 3726)

Metal working

Method of mechanical manufacture

Shaping one-piece blank by removing material

C029S558000, C623S001150

Reexamination Certificate

active

06862794

ABSTRACT:
A method of manufacturing an endovascular support device comprises providing a generally tubular member of an implantable material having a first, generally cylindrical outer surface and a second, generally cylindrical inner surface. At least a portion of the outer and inner surfaces of the tubular member are shaped in such a way to form a plurality of generally circular edgeless ring regions. Adjacent ring regions are connected together by one of a plurality of connecting regions. Openings are produced in the connecting regions in accordance with a predetermined pattern, and the generally tubular member is longitudinally expanded to form the support device.

REFERENCES:
patent: 5780807 (1998-07-01), Saunders
patent: 5817152 (1998-10-01), Birdsall et al.
patent: 5836965 (1998-11-01), Jendersee et al.
patent: 5843117 (1998-12-01), Alt et al.
patent: 6027526 (2000-02-01), Limon et al.
patent: 6146417 (2000-11-01), Ischinger
patent: 6309412 (2001-10-01), Lau et al.
patent: 6511504 (2003-01-01), Lau et al.
patent: 6612012 (2003-09-01), Mitelberg et al.
patent: 1 088 528 (2001-04-01), None
patent: 1 266 637 (2002-12-01), None
patent: WO01/89420 (2001-11-01), None

Affiliated with

Also associated with

Rating

Method for manufacturing an endovascular support device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing an endovascular support device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing an endovascular support device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3389950