Method for manufacturing an embossed pattern in a portable mediu

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156219, 156220, 156267, 156268, 156510, 156523, 430256, B32B 3118, B32B 3128

Patent

active

048971332

ABSTRACT:
A method for manufacturing an embossed pattern in a base material comprises the steps of forming an embossed portion in the base material; cutting the embossed portion by using a cutter and a controller for three-dimensionally controlling the relative position between the cutter and the base material; and forming a predetermined embossed pattern in the base material. A method for manufacturing embossed patterns comprises the steps of holding processing data per each of the embossed patterns; and processing the embossed patterns by continuously connecting the processing data to each other sequentially. A method for manufacturing embossed patterns comprises the steps of dividing processing data of the patterns into left and right sections with respect to each of the patterns to process the patterns left and right; providing the same number of upper and lower processing lines with respect to the patterns; and continuously processing portions between the patterns.
An apparatus for forming an embossed pattern in a portable medium in which an embossed portion having an area larger than that of the embossed pattern is formed in a position for forming the embossed pattern on a surface of the medium. The apparatus comprises a cutter for cutting the embossed portion on the medium along the surface of the medium, and a device for memorizing embossed pattern information to be formed and controlling a relative position of the cutter with respect to the medium in accordance with the embossed pattern information.

REFERENCES:
patent: 3897964 (1975-08-01), Oka et al.
patent: 3930924 (1976-01-01), Oka et al.

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