Method for manufacturing an electronic component

Details Method for manufacturing an electronic component Method for manufacturing an electronic component

2006-03-14

2006-03-14

Tugbang, A. Dexter (Department: 3729)

Metal working

Piezoelectric device making

C029S594000, C029S831000, C029S846000, C029S847000, C427S523000

Reexamination Certificate

active

07010837

ABSTRACT:
A method for manufacturing an electronic component includes the steps of forming an electrode layer including α-tungsten on a substrate at a substrate temperature of about 100° C. to about 300° C. by a sputtering process, processing the electrode layer so as to have a desired shape, and heat-treating the electrode layer. An electronic component includes a substrate and an electrode layer that is disposed on the substrate directly or indirectly, includes α-tungsten, and has a specific resistance of about 15 μΩ.cm or less and a warpage of about 120 μm or less. A surface acoustic wave filter includes a piezoelectric substrate and an electrode layer, disposed on the piezoelectric substrate, including α-tungsten.

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Official Communication Issued in the corresponding Chinese Application No. 03128667.4, dated Jul. 15, 2005.

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