Method for manufacturing an electronic component

Details Method for manufacturing an electronic component Method for manufacturing an electronic component

2008-05-13

2008-05-13

Tugbang, A. Dexter (Department: 3729)

Metal working

Piezoelectric device making

C029S594000, C029S831000, C029S832000, C029S835000, C310S311000, C310S324000

Reexamination Certificate

active

07370396

ABSTRACT:
An electronic component includes a substrate; a piezoelectric material layer supported directly or indirectly by the substrate; a first electrode arranged on a surface of the piezoelectric material layer on an opposite side of the substrate; and a second electrode arranged on a surface of the piezoelectric material layer on the substrate side. The piezoelectric material layer is sandwiched between the first electrode and the second electrode. The first electrode has a smaller surface area than the piezoelectric material layer. A portion where the piezoelectric material layer is exposed from the first electrode includes a portion that is thinner than a thickness of the piezoelectric material layer between the first electrode and the second electrode. Thus, it is possible to configure a resonator with a higher frequency than its ordinary resonance, and it is easy to achieve an adjustment of the resonance frequency of the resonator, as well as improving the yield of the component and enabling the configuration of an electronic component that includes a plurality of resonators of different frequencies.

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K. M. Lakin: “Thin Film Resonators and High Frequency Filters”, Technical Report TFR Technologies, Jun. 1, 2001, pp. 1-18, XP-002276553.

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