Metal working – Method of mechanical manufacture – Electrical device making
Patent
1995-03-09
1996-06-18
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
359 82, 359 88, H05K 336
Patent
active
055265634
ABSTRACT:
A flexible wiring board is constructed by placing, on a surface of a flexible ultraviolet-transmissive base member in the form of a layer, a conductive member in the form of a layer and a covering member in the form of a layer. The conductive member has an exposed leading area not covered with the covering member. A lead is aligned with an electrode and they are connected together with pressure exerted by a pressure applying jig which is ultraviolet-transmissive. A photosetting adhesive resin capable of shrinking in volume is injected between the flexible wiring board and a printed circuit board. The photosetting adhesive resin is irradiated with ultraviolet passing through the pressure applying jig and the base member. When irradiated with the ultraviolet rays, the photosetting adhesive resin hardens. Volume shrinkage force exerted by the photosetting adhesive resin enhances the connection between the lead and the electrode. Such a connecting procedure can be performed at room temperature thereby cutting down the cost of the flexible board and providing a wider range of applications thereof.
REFERENCES:
patent: 4346516 (1982-08-01), Yokouchi et al.
patent: 4431270 (1984-02-01), Funada et al.
patent: 4654965 (1987-04-01), Uehara
patent: 4964700 (1990-10-01), Takabayashi
patent: 5311341 (1994-05-01), Hirai
patent: 5317438 (1994-05-01), Suzuki et al.
Fujimoto Hiroaki
Nagao Kouichi
Nishihara Kazunari
Tamaki Tomohiro
Arbes Carl J.
Matsushita Electric - Industrial Co., Ltd.
LandOfFree
Method for manufacturing an electronic component does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing an electronic component, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing an electronic component will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-215383