Electricity: conductors and insulators – Boxes and housings – With electrical device
Reexamination Certificate
2011-02-08
2011-02-08
Ngo, Hung V (Department: 2831)
Electricity: conductors and insulators
Boxes and housings
With electrical device
C174S558000, C257S707000, C257S737000, C257S778000, C029S825000
Reexamination Certificate
active
07884289
ABSTRACT:
The present invention relates to a method for manufacturing an electronic assembly (50) comprising an electronic component, a cavity and a substrate which method comprises; —providing an electronic component (10) having a first pattern with a substantially closed configuration; —providing a cover (18) on a surface of the electronic component, which cover together with said surface defines a cavity (20), the closed configuration of the first pattern substantially enclosing the cover at said surface; —providing a substrate (30) having a second pattern with a substantially closed configuration, which closed configuration at least partially corresponds to the closed configuration of the first pattern and comprises a solder pad; —disposing solder material at the solder pad; —positioning the electronic component and the substrate so as to align both the substantially closed configurations of the first and second pattern, while the substrate supports a top surface (28) of the cover; —reflow-soldering the solder material, therewith providing a soldered connection (52) between the first and second pattern. Furthermore the present invention relates to an electronic assembly (50), a cover (18) and a substrate (30).
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Scheer Jacob M.
Slob Cornelis
Van Straten Freerk E.
Weekamp Johannes W.
Ngo Hung V
NXP B.V.
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