Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1991-10-11
1993-08-17
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427404, 427405, C23C 2600
Patent
active
052367363
ABSTRACT:
A printed-wiring board shielded from electromagnetic wave radiation is made by forming a conductive circuit pattern on an insulating substrate, disposing a first insulating layer over the circuit pattern, forming a jumper wire over the first insulating layer and between connecting terminals of the conductive pattern, forming a second insulating layer covering the jumper wire and the first insulating layer, and disposing an electromagnetic wave shielding layer over the conductive pattern. The jumper wire is formed by a printing process using a conductive paste containing a conductive metal such as silver, carbon or copper. The shield layer is formed by a printing process using a conductive metal resin paste such as copper. The shield layer is protected by providing an overcoat layer over the shield layer.
REFERENCES:
patent: 4801489 (1989-01-01), Nakagawa
patent: 4970354 (1990-11-01), Iwasa
patent: 5030800 (1991-07-01), Kawakami
patent: 5112648 (1992-05-01), Okonogi
Kawakami Shin
Nikaido Katsutomo
Nishiyama Yoshio
Okonogi Hirotaka
Adams Bruce L.
Beck Shrive
Dang Vi D.
Nippon CMK Corp.
Wilks Van C.
LandOfFree
Method for manufacturing an electromagnetic wave shield printed does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing an electromagnetic wave shield printed , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing an electromagnetic wave shield printed will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2242533