Acoustics – Anatomic or prosthetic relation – Ear and mouth
Reexamination Certificate
2005-03-08
2005-03-08
Hsieh, Shih-Yung (Department: 2837)
Acoustics
Anatomic or prosthetic relation
Ear and mouth
C181S135000, C381S325000, C381S322000, C381S328000, C264S401000, C700S163000
Reexamination Certificate
active
06863151
ABSTRACT:
An apparatus for manufacturing ear devices that are individualized for individual. Data of the three-dimensional shape of each individual's area of application for a haring device is provided. Individual shells for the hearing devices are construed by respectively depositing commonly a layer of one of a liquid and a powderous material and solidifying by a laser arrangement in the layer individually shaped layers of the individual shells, thereby controlling the laser arrangement with the data.
REFERENCES:
patent: 4091067 (1978-05-01), Kramer et al.
patent: 4984277 (1991-01-01), Bisgaard et al.
patent: 5056204 (1991-10-01), Bartschi
patent: 5068902 (1991-11-01), Ward
patent: 5121333 (1992-06-01), Riley et al.
patent: 5487012 (1996-01-01), Topholm et al.
patent: 5641448 (1997-06-01), Yeung et al.
patent: 5979589 (1999-11-01), Aceti
patent: 6129174 (2000-10-01), Brown et al.
patent: 6495214 (2002-12-01), Prix et al.
patent: 0 010 200 (1998-03-01), None
patent: 40 41 105 (1992-06-01), None
patent: 0 516 808 (1996-01-01), None
patent: 0034739 (2000-06-01), None
patent: 01 05207 (2001-01-01), None
Article: “The Selective Laser Sintering Process Third Generation Desk Top Manufacturing,” DTM Corporation, Jun. 4, 1990.
Dutta Joydeep
Widmer Christoph
Hsieh Shih-Yung
Pearne & Gordon LLP
Phonak AG
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