Method for manufacturing a workpiece carrier backing pad and pre

Details Method for manufacturing a workpiece carrier backing pad and pre Method for manufacturing a workpiece carrier backing pad and pre

1999-03-26

2000-08-01

Eley, Timothy V.

Abrading

Abrading process

451364, 451294, 451 41, 451 28, 1563071, B24B 4106, B24B 100

Patent

active

060959002

ABSTRACT:
A carrier for semiconductor wafers to be polished comprises a backing pad vulcanized to a pressure plate. The backing pad is formed of a rubber material such as neoprene, SBR or natural rubber. An adhesive film of a thermosetting, thermally reactive material forms an integral bond between the backing pad and pressure plate. The backing pad, adhesive film and pressure plate together comprise a nearly ideally elastic assembly. The exposed face of the backing pad is profiled to a desired profile without effecting crumbling of the rubber material.

REFERENCES:
patent: 3731435 (1973-05-01), Boettcher et al.
patent: 3841031 (1974-10-01), Walsh
patent: 3842544 (1974-10-01), Paola
patent: 4132037 (1979-01-01), Bonora
patent: 4141180 (1979-02-01), Gill, Jr. et al.
patent: 4221083 (1980-09-01), Carroll
patent: 4258508 (1981-03-01), Wilson et al.
patent: 4319432 (1982-03-01), Day
patent: 4519168 (1985-05-01), Cesna
patent: 4811522 (1989-03-01), Gill, Jr.
patent: 4918869 (1990-04-01), Kitta
patent: 5101602 (1992-04-01), Hashimoto
patent: 5157877 (1992-10-01), Hashimoto
patent: 5205082 (1993-04-01), Shendon et al.
patent: 5232875 (1993-08-01), Tuttle et al.
patent: 5329732 (1994-07-01), Karlsrud et al.
patent: 5335457 (1994-08-01), Matsuda et al.
patent: 5409770 (1995-04-01), Netsu et al.
patent: 5534053 (1996-07-01), Payne et al.
patent: 5538465 (1996-07-01), Netsu et al.
patent: 5573448 (1996-11-01), Nakazima et al.
patent: 5624299 (1997-04-01), Shendon
patent: 5791975 (1998-08-01), Cesna et al.
patent: 5913719 (1999-06-01), Hasegawa et al.

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