Method for manufacturing a wiring substrate

Details Method for manufacturing a wiring substrate Method for manufacturing a wiring substrate

2007-12-18

2010-11-30

Banks, Derris H (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S831000, C029S846000, C029S852000, C029S854000, C174S254000

Reexamination Certificate

active

07841077

ABSTRACT:
A wiring substrate comprises: a flexible substrate having a first region and a second region; a wiring line formed on the flexible substrate; and an electronic element that is disposed on the flexible substrate in the first region and electrically coupled to the wiring line. Flexibility of the first region is lower than flexibility of the second region.

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patent: 2005-303172 (2005-10-01), None
patent: 2006-099163 (2006-04-01), None

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