Method for manufacturing a thin-film magnetic head wafer

Details Method for manufacturing a thin-film magnetic head wafer Method for manufacturing a thin-film magnetic head wafer

2006-10-03

2006-10-03

Kim, Paul D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S603070, C029S065000, C029S603150, C029S603160, C029S603180, C216S065000, C360S234100, C360S234200, C360S234300, C427S127000, C427S128000, C451S005000, C451S041000

Reexamination Certificate

active

07114239

ABSTRACT:
A thin-film magnetic head wafer includes a first principal surface and a second principal surface which are substantially parallel to each other. An electrical/magnetic transducer is provided on the first principal surface. Identification information is recorded on the first principal surface of the wafer.

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“Theory and application of passive SAW radio transponders as sensors”; Reindl, L.; Scholl, G.; Ostertag, T.; Scherr, H.; Wolff, U.; Schmidt, F.; Ultrasonics, Ferroelectrics and Frequency Control, Sep. 5, 1998; pp. 1281-1292.

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