Method for manufacturing a thin closure magnetic head

Details Method for manufacturing a thin closure magnetic head Method for manufacturing a thin closure magnetic head

2007-08-30

2010-11-30

Kim, Paul D (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S603070, C029S603130, C029S603140, C029S603150, C029S603180, C125S012000, C125S013010, C125S035000, C216S022000, C216S052000, C216S053000, C216S088000, C216S089000, C360S121000, C360S122000, C360S317000

Reexamination Certificate

active

07841069

ABSTRACT:
A method of manufacturing thin closure magnetic read/write heads, such as magnetic tape heads is provided. The method provides improved flexural strength of the closure so that the closure breakage during fabrication of the heads is mitigated and closure thickness is reduced. An array of chips is fabricated on a wafer. The array is closed, with a closure strip bonded to each row of the array. Closures span only the length of a row, so that the closures are not subjected to flexure during processing and breakage due to flexure is mitigated. Side bars are bonded to the array to form a column with dimensions similar to prior art columns. This allows columns manufactured by the invention to undergo additional processing using existing processes.

REFERENCES:
patent: 5309457 (1994-05-01), Minch
patent: 6043590 (2000-03-01), Gilmore
patent: 6351481 (2002-02-01), Marcomber et al.
patent: 6712985 (2004-03-01), Biskeborn
patent: 6863061 (2005-03-01), Deshpande et al.
patent: 2005/0122631 (2005-06-01), Biskeborn et al.

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