Method for manufacturing a surface acoustic wave element...

Metal working – Piezoelectric device making

Reexamination Certificate

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C029S830000, C029S831000, C029S832000, C029S846000, C029S847000, C310S31300R

Reexamination Certificate

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07484280

ABSTRACT:
A method for manufacturing a surface acoustic wave element having an interdigital transducer (IDT) electrode formed on a semiconductor substrate includes a) forming an insulation layer on a surface of an active side of the semiconductor substrate, b) forming a base layer on a whole surface of the insulation layer, c) planarizing a surface of the base layer, d) forming a piezoelectric member on a planarized surface of the base layer, e) forming the IDT electrode on a surface of the piezoelectric member, and f) forming a bank being higher than a height from the surface of the base layer to the surface of the IDT electrode on a peripheral of the surface of the base layer so as to surround the piezoelectric member.

REFERENCES:
patent: 5221870 (1993-06-01), Nakahata et al.
patent: 5440189 (1995-08-01), Nakahata et al.
patent: 5459368 (1995-10-01), Onishi et al.
patent: 6046656 (2000-04-01), Mishima
patent: A 5-152881 (1993-06-01), None
patent: A-10-112624 (1998-04-01), None
patent: A 2002-33410 (2002-01-01), None
patent: A-10-2004-0092728 (2004-11-01), None

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