Method for manufacturing a surface acoustic wave

Metal working – Piezoelectric device making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C029S600000, C029S832000, C029S835000, C029S846000, C310S31300R

Reexamination Certificate

active

07418772

ABSTRACT:
In a manufacturing method for a SAW apparatus a first insulating layer is formed on the entire surface of a piezoelectric LiTaO3substrate. By using a resist pattern used for forming an IDT electrode, the first insulating layer in which the IDT electrode is to be formed is removed. An electrode film made of a metal having a density higher than Al or an alloy primarily including such a metal is disposed in the area in which the first insulating layer is removed so as to form the IDT electrode. The resist pattern remaining on the first insulating layer is removed. A second insulating layer is formed to cover the first insulating layer and the IDT electrode.

REFERENCES:
patent: 3965444 (1976-06-01), Willingham et al.
patent: 4243960 (1981-01-01), White et al.
patent: 4527082 (1985-07-01), Cline
patent: 5390401 (1995-02-01), Shikata et al.
patent: 5844347 (1998-12-01), Takayama et al.
patent: 5909156 (1999-06-01), Nishihara
patent: 5920142 (1999-07-01), Onishi et al.
patent: 5923231 (1999-07-01), Ohkubo et al.
patent: 5996199 (1999-12-01), Ichikawa
patent: 6046656 (2000-04-01), Mishima
patent: 6336717 (2002-01-01), Shimada et al.
patent: 6580198 (2003-06-01), Nakano et al.
patent: 6657366 (2003-12-01), Watanabe et al.
patent: 6774542 (2004-08-01), Anasako
patent: 6861786 (2005-03-01), Hakamada
patent: 920 129 (1999-06-01), None
patent: 58-56514 (1983-04-01), None
patent: 61-136312 (1986-06-01), None
patent: 01-233816 (1989-09-01), None
patent: 02-295212 (1990-12-01), None
patent: 05-022067 (1993-01-01), None
patent: 06-103819 (1994-04-01), None
patent: 06-164306 (1994-06-01), None
patent: 09-167936 (1997-06-01), None
patent: 09-223944 (1997-08-01), None
patent: 11-186866 (1999-07-01), None
patent: 2000-269771 (2000-09-01), None
patent: 2001-77662 (2001-03-01), None
patent: 2001-148618 (2001-05-01), None
patent: 98/51011 (1998-11-01), None
patent: 02/19522 (2002-03-01), None
Schmidt et al.; “Investigation of SAW-Induced Acoustomigration Effects in CU- and Al-Based Metallizations” 2001 IEEE Ultrasonics Symposium Proceedings; Vp; 2 of 2; pp. 97-100.
Jin Yong Kim et al.; “Passivation Layer Effects on Power Durability of SAW Duplexer”; Ultrasonics Symposium; Oct. 1999; pp. 39-42.
Takayama et al.; “High Power Durable Electrodes for GHz band SAW Duplexers”; IEEE Ultrasonics Symposium; vol. 1; Oct. 2000; pp. 9-14.
Official Communication dated Dec. 26, 2005 issued in the counterpart Korean Application No. 10-2003-0034334.2
J. Koskela et al.; “Suppression of the Leaky Saw Attenuation With Heavy Mechanical Loading”; IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control; IEEE Inc.; New York, U.S.; vol. 45; No. 2; Mar. 1, 1998; pp. 439-449.
O. Kawachi et al.; “Optimal Cut for Leaky Saw on LiTaO3 for High Performance Resonators and Filters”; IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control; Sep. 2001; IEEE; USA; vol. 48; No. 5; pp. 1442-1448.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for manufacturing a surface acoustic wave does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing a surface acoustic wave, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing a surface acoustic wave will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3985456

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.