Coating processes – Spray coating utilizing flame or plasma heat – Metal oxide containing coating
Patent
1993-04-05
1994-03-01
Owens, Terry J.
Coating processes
Spray coating utilizing flame or plasma heat
Metal oxide containing coating
427454, 427455, 427535, 427576, 427 96, 4271264, 427387, 427404, 427409, 4274191, 51320, B05D 108
Patent
active
052906060
ABSTRACT:
In a method for the manufacture of a substrate for electrical components, a base of metallic material is first sandblasted and thereafter coated by means of a thermal process with a bonding layer of, for example, copper powder. Then the bonding layer is coated with a dielectric layer of a ceramic material, which also is applied by means of a thermal process, and the ceramic material is thereafter impregnated with silicone oil. Finally, the ceramic layer is provided with an electrical conducting layer, also by means of a thermal process, having a predetermined electrical conducting pattern and the finished substrate is cleaned by blasting it with glass spheres.
REFERENCES:
patent: 3607381 (1971-09-01), Fairbairn
patent: 4031268 (1977-06-01), Fairbairn
patent: 4294009 (1981-10-01), Quintin et al.
patent: 4444804 (1984-04-01), Ferrari
patent: 4675784 (1987-06-01), Dahlberg et al.
patent: 4864106 (1989-09-01), Lorenz et al.
Plastic Coatings for Electronics, McGraw Hill, 1970 pp. 46-47.
Condensed Chemical Dictionary, 10th ed. pp. 919, 921, 922 (1981).
Hestevik Svein
Storfossene Tore
Owens Terry J.
Utech Benjamin L.
LandOfFree
Method for manufacturing a substrate for a printed circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing a substrate for a printed circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing a substrate for a printed circuit board will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-575574