Method for manufacturing a soldered article

Details Method for manufacturing a soldered article Method for manufacturing a soldered article

1989-11-15

1990-12-25

Heinrich, Sam

Metal fusion bonding

Process

Plural joints

228219, 228234, B23K 1012, H05K 334

Patent

active

049796640

ABSTRACT:
Disclosed is a method for making a solder joint without flux, in the presence of an inert gas. A pair of articles having solder-coated surfaces are heated to melt the solder, pressure is applied to the joint region, and the articles are cooled. During the heating step, inert gas is flowed over the articles.

REFERENCES:
patent: 3303393 (1967-02-01), Hymes et al.
patent: 3475814 (1969-11-01), Santangini
patent: 3705457 (1972-12-01), Tardoskegyi
patent: 3900151 (1975-08-01), Schoer et al.
patent: 3912153 (1975-10-01), Hartleroad et al.
patent: 4270265 (1981-06-01), Ikeda et al.
patent: 4295596 (1981-10-01), Doten et al.
patent: 4605152 (1986-08-01), Fridman
patent: 4615952 (1986-10-01), Knoll
patent: 4646958 (1987-03-01), Howard, Jr.
patent: 4659004 (1987-04-01), Fridman
patent: 4693770 (1987-09-01), Hatada
patent: 4702969 (1987-10-01), Bunkoczy et al.
patent: 4789096 (1988-12-01), Dunn et al.
patent: 4821947 (1989-04-01), Nowotarski
patent: 4857671 (1989-08-01), Nakano et al.
IBM Technical Disclosure Bulletin, "Solder Reflow Tool", vol. II, No. 10, p. 1298, Mar. 1969.
IBM Technical Disclosure Bulletin, "Surface Mount Component Lead Hold-Down Mechanism", vol. 31, No. 9, pp. 85-87, Feb. 1989.
Surface Mount Technology, "How to Use Integral Vision and Reflow for Placement of Fine Pitch SMCs", pp. 31, 32, Feb. 1987.
Mizuishi, K. et al, "Fluxless and Substantially Voidless Soldering for Semiconductor Chips," IEEE 38th Components Conference Proceedings, May, 1988, pp. 330-334.
Ammann, H. H. et al, "Fluxless Condensation Soldering," Proc. of the Technical Program, National Electronic Pkg and Prod. Conf., Feb. 26-28, 1980, vol. 1, pp. 7-11.

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