Metal working – Method of mechanical manufacture – Electrical device making
Patent
1993-09-14
1995-05-02
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
437209, 437220, H01R 4300
Patent
active
054108047
ABSTRACT:
Encapsulated integrated circuits (chips) (2, 3, 4, 5, 6) are manufactured by separating the encapsulated integrated circuits arranged on a lead frame (1), subsequently cutting away the lead-connecting strips (7) of the individual products, then bending the leads and finally cutting them to length. By subjecting the products individually to the above stated method steps, products in a great variety of dimensions can be processed. The method and device according to the invention are particularly suitable for manufacturing pilot series on laboratory scale.
REFERENCES:
patent: 3650232 (1972-03-01), Heinlen
patent: 4103718 (1978-08-01), Steigerwald
patent: 4907628 (1990-03-01), Corey et al.
patent: 4977442 (1990-12-01), Suzuki et al.
patent: 5012664 (1991-05-01), Hembree
patent: 5078186 (1992-01-01), Togashi et al.
patent: 5094982 (1992-03-01), Suzuki et al.
patent: 5127447 (1992-07-01), Furudate et al.
patent: 5146662 (1992-09-01), Fierkens
patent: 5251679 (1993-10-01), Schweizer
patent: 5271148 (1993-12-01), Desrochers et al.
Patent Abstracts of Japan, vol. 10, No. 272, (E-437) (2328), 16 Sep. 1986 & JP A 61 094 349 (Sanken Electric Co. Ltd.), 13 May 1986.
Patent Abstracts of Japan, vol. 7, No. 267, (E-213) (1412), 29 Nov. 1983 & JP A 58 151 047 (Nippon Kogyo K.K.), 8 Sep. 1983.
Arbes Carl J.
ASM-Fico Tooling B.V.
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