Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Reexamination Certificate
2007-02-06
2007-02-06
Lam, Cathy F. (Department: 1775)
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
C428S901000, C174S250000, C174S255000, C174S261000, C174S262000
Reexamination Certificate
active
10887484
ABSTRACT:
A method for manufacturing a mid-plane. a multi-layer board having a connection assembly is provided and a dielectric layer with a channel formed therein to define a perimeter of a connector area is provided. The dielectric layer is bonded to the multi-layer board such that the connector area overlaps the part of the connection assembly of the multi-layer board. At least a portion of the connector area in the dielectric layer is removed to expose the connection assembly of the multi-layer board. A rigid multilayer is also disclosed. The rigid multilayer includes a multi-layer board and a dielectric layer. The multi-layer board has a connection assembly. The dielectric layer has a channel formed therein to define a perimeter of a connector area. The dielectric layer is bonded to the multi-layer board such that the connector area overlaps the connection assembly of the multi-layer board. The connector area can then be removed such as by depth controlled routing. As will be understood by one skilled in the art, the depth tolerance is not critical because the dielectric layer is pre-formed with the channel prior to formation of the rigid multi-layer.
REFERENCES:
patent: 3610811 (1971-10-01), O'Keefe
patent: 3756891 (1973-09-01), Ryan
patent: 4030190 (1977-06-01), Varker
patent: 4478469 (1984-10-01), Waite et al.
patent: 4686607 (1987-08-01), Johnson
patent: 4943334 (1990-07-01), Medney et al.
patent: 5199879 (1993-04-01), Kohn et al.
patent: 5376326 (1994-12-01), Medney et al.
patent: 5400220 (1995-03-01), Swamy et al.
patent: 5592737 (1997-01-01), Middelman et al.
patent: 5633072 (1997-05-01), Middelman et al.
patent: 5690270 (1997-11-01), Gore
patent: 5826329 (1998-10-01), Roth
patent: 5869356 (1999-02-01), Fuller, Jr. et al.
patent: 5904581 (1999-05-01), Pope et al.
patent: 6016598 (2000-01-01), Middelman et al.
patent: 6135781 (2000-10-01), Pope et al.
patent: 6174562 (2001-01-01), Bergstedt
patent: 6201305 (2001-03-01), Darveaux et al.
patent: 6456498 (2002-09-01), Larsen et al.
patent: 6528737 (2003-03-01), Kwong et al.
patent: 6535397 (2003-03-01), Clark et al.
patent: 6538899 (2003-03-01), Krishnamurthi et al.
patent: 6564450 (2003-05-01), Engbring et al.
patent: 2002/0181217 (2002-12-01), Patriche
patent: 2004/0108137 (2004-06-01), Vetter et al.
patent: 0438012 (1991-07-01), None
patent: 0438012 (1991-07-01), None
patent: 2101411 (1983-01-01), None
Hermkens Gerald A. J.
Smeets Marcel
Speetjens Frank
Theelen Roger
Thoolen Peter J. M.
Dunlap Codding & Rogers P.C.
Lam Cathy F.
Viasytems Group, Inc.
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