Method for manufacturing a sensor device with a stress...

Details Method for manufacturing a sensor device with a stress... Method for manufacturing a sensor device with a stress...

2011-03-08

2011-03-08

Quach, Tuan N. (Department: 2893)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Thermally responsive

C438S113000, C257SE21599

Reexamination Certificate

active

07901971

ABSTRACT:
A method for packaging a sensor device having a sensitive structure integrated on a semiconductor chip is provided. When molding the device package, an inward extending section of the mold maintains an access opening to the sensor. A buffer layer is arranged on the chip between the inward extending section and the sensitive structure. The buffer layer protects the sensitive structure from damage by the inward extending section and acts as a seal while casting the housing. The buffer layer also covers at least part of the semiconductor electronic components of the circuitry integrated onto the chip. By covering these components, mechanical stress, as it is e.g. caused by different thermal expansion coefficients of the packaging and the chip, can be reduced.

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