Method for manufacturing a semiconductor wiring base that...

Details Method for manufacturing a semiconductor wiring base that... Method for manufacturing a semiconductor wiring base that...

2007-07-19

2009-06-16

Smoot, Stephen W (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S126000, C257SE21511

Reexamination Certificate

active

07547580

ABSTRACT:
A method for manufacturing a semiconductor device is provided. A resin paste is applied to a wiring base including a wiring pattern. Then, a semiconductor chip having a plurality of electrodes is mounted to the wiring base. The electrodes and the wiring pattern face one another and are electrically connected. The wiring base and the semiconductor chip are bonded by curing the resin paste. The wiring pattern includes a wiring that continuously includes two or more first parts located inside a semiconductor chip mounting region and a second part that connects at least two of the first parts. The second part is located outside the semiconductor chip mounting region.

REFERENCES:
patent: 5252853 (1993-10-01), Michii
patent: 6462522 (2002-10-01), Burstein et al.
patent: 6476467 (2002-11-01), Nakamura et al.
patent: 05-082585 (1993-04-01), None
patent: 2000-340934 (2000-12-01), None
patent: 2001-237265 (2001-08-01), None
patent: 2001-284413 (2001-10-01), None
Communication from Japanese Patent Office re: counterpart application, Feb. 2, 2005.

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