Method for manufacturing a semiconductor wafer which is coated o

Details Method for manufacturing a semiconductor wafer which is coated o Method for manufacturing a semiconductor wafer which is coated o

1998-01-06

2000-04-18

Utech, Benjamin L.

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

438692, H01L 21302

Patent

active

060514981

ABSTRACT:
A method for manufacturing a semiconductor wafer which is coated on one s and provided with a finish has a) the semiconductor wafer being subjected to a first treatment (double-sided finish) which produces a finish on both sides of the semiconductor wafer at the same time; has b) at least one coating being produced on one side of the semiconductor wafer; and has c) the semiconductor wafer being subjected to a second treatment which produces a double-sided finish.

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patent: 5759088 (1998-06-01), Kondratenko

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