Method for manufacturing a semiconductor package with a...

Details Method for manufacturing a semiconductor package with a... Method for manufacturing a semiconductor package with a...

2005-03-14

2008-03-18

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S118000, C257S684000, C257SE21500

Reexamination Certificate

active

07344915

ABSTRACT:
A method for manufacturing a semiconductor package with a laminated chip cavity is disclosed. A board and a metal foil having a layer of adhesive resin are provided. The metal foil is laminated with the board to make the adhesive resin be attached to the board. Next, a through opening is formed to pass through the board, the adhesive resin and the metal foil. Next, the metal foil is removed to expose an adhesive surface of the adhesive resin on the board so as to attach a carrier plate, thereby forming a chip cavity.

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