Method for manufacturing a semiconductor memory device having a

Details Method for manufacturing a semiconductor memory device having a Method for manufacturing a semiconductor memory device having a

1984-01-04

1987-06-30

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

357 72, 174 52PE, 1563311, H01L 2328, H01L 2330

Patent

active

046759859

ABSTRACT:
In a method for manufacturing a semiconductor memory device, a semiconductor chip and an adhesive tape having an adhesive layer are prepared. The adhesive layer comprises a polyamic acid intermediate derived for example from a pyromellitic dianhydride and a diamine. The adhesive tape is pressed onto the semiconductor chip at a temperature of from about 250.degree. C. to about 400.degree. C. for a predetermined time period such as 2 to 5 sec.

REFERENCES:
patent: 4284461 (1981-08-01), St. Clair et al.

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