Method for manufacturing a semiconductor device with a slotted m

Details Method for manufacturing a semiconductor device with a slotted m Method for manufacturing a semiconductor device with a slotted m

1991-06-03

1993-04-27

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437226, 148DIG28, H01L 21304

Patent

active

052061817

ABSTRACT:
A method for semiconductor wafer scribing utilizing perforated metal areas in the scribe regions. In one form, a method for fabricating a semiconductor device includes forming a plurality of semiconductor die (12) on a semiconductor wafer (10) such that the die are separated from one another by scribe regions (13). A test structure (14) is formed within one of the scribe regions and includes a perforated probe pad (16). In one embodiment, the probe pad is perforated by a plurality of slots (18). The perforations in the probe pad aid in scribing the semiconductor wafer by preventing metal lift-off which often occurs when cutting metal areas.

REFERENCES:
patent: 4610079 (1986-09-01), Abe et al.
patent: 4835592 (1989-05-01), Zommer
patent: 5003374 (1991-03-01), Vokoun, III
patent: 5096855 (1992-03-01), Vokoun, III

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