Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2011-04-12
2011-04-12
Mai, Anh D (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S119000, C438S456000, C257SE21511, C257SE21514
Reexamination Certificate
active
07923293
ABSTRACT:
A method for manufacturing a semiconductor device includes: (a) transferring an electronic component that has an electrode and formed on a first substrate from the first substrate to a second substrate; and (b) forming a wiring line electrically coupling the electrode and a terminal on the second substrate. A cavity is provided between the electrode of the electronic component transferred on the second substrate and the second substrate, and the wiring line is formed in the cavity.
REFERENCES:
patent: A-11-24106 (1999-01-01), None
patent: A-2005-158776 (2005-06-01), None
patent: A-2005-277277 (2005-10-01), None
patent: A 2005-302813 (2005-10-01), None
patent: A-2005-308832 (2005-11-01), None
patent: A-2006-319016 (2006-11-01), None
Mai Anh D
Oliff & Berridg,e PLC
Seiko Epson Corporation
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