Method for manufacturing a semiconductor device wherein a semico

Details Method for manufacturing a semiconductor device wherein a semico Method for manufacturing a semiconductor device wherein a semico

1995-07-16

1997-03-18

Picardat, Kevin

Fishing, trapping, and vermin destroying

437214, 437217, 437219, 437220, H01L 2160

Patent

active

056122594

ABSTRACT:
In a semiconductor device and a method for manufacturing the same according to the present invention, each of electrode pads on a semiconductor chip is bonded to an inner lead section of each of leads of a carrier tape by a connecting electrode. An insulating film of the carrier tape is then adhered to the surface of the semiconductor chip by interposing an adhesive layer between them. Thus, the electrode pads and inner lead sections are stably bonded, and the flatness of the carrier tape is maintained by the flatness of the surface of the semiconductor chip. It is thus possible to prevent the flatness of the outer lead sections of the leads from being degraded when the number of leads is small, and to improve in mounting the semiconductor chip by reflow soldering.

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