Method for manufacturing a semiconductor device wherein a semico

Details Method for manufacturing a semiconductor device wherein a semico Method for manufacturing a semiconductor device wherein a semico

1995-06-05

1996-09-17

Picardat, Kevin M.

Fishing, trapping, and vermin destroying

437211, 437214, 437217, 437219, H01L 2160

Patent

active

055568106

ABSTRACT:
A plurality of electrode pads are formed on a main surface of a semiconductor chip. The electrode pads on the semiconductor chip are electrically connected to the top end of an inner lead through a metal plating layer.

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