Method for manufacturing a semiconductor device utilizing self-a

Metal working – Method of mechanical manufacture – Assembling or joining

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29578, 29580, 29591, 29577C, 148 15, 148174, 148187, 148DIG19, 148DIG20, 148DIG106, 148DIG139, 148DIG141, 148DIG147, 156643, 156652, 156653, 357 15, 357 71, H01L 2128, H01L 21306

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046227350

ABSTRACT:
A method for manufacturing a semiconductor device of the invention comprises the steps of

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Kircher et al., "Interconnection Method for Integrated Circuit", I.B.M. Tech. Discl. Bull., vol. 13, No. 2, Jul. 1970, p. 436.
IBM Technical Disclosure Bulletin, vol. 21, No. 3, Aug. 1978, pp. 2150-1251, New York.
Nikkei Electronics, Sep. 1, 1980, pp. 62-65.

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