Method for manufacturing a semiconductor device substrate

Details Method for manufacturing a semiconductor device substrate Method for manufacturing a semiconductor device substrate

2008-01-08

2008-01-08

Deo, Duy-Vu N (Department: 1765)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S693000, C257S070000, C257S737000, C257S738000

Reexamination Certificate

active

11279002

ABSTRACT:
Disclosed is a method for manufacturing a semiconductor device substrate. A substrate having no bus line and lead-in line is efficiently manufactured. In a step needing an electroplating process, conductive film is temporarily attached to circuit patterns in order to electrically connect all circuit patterns. A plating is formed in desired regions of the circuit patterns with a predetermined thickness in an electroplating method. The conductive film is completely removed while the substrate is manufactured so that the circuit patterns are electrically independent of one another, and the resulting substrate has no bus line and lead-in line.

REFERENCES:
patent: 2005/0266608 (2005-12-01), Ho et al.
patent: 2006/0017151 (2006-01-01), Yoon et al.
patent: 2006/0145343 (2006-07-01), Lee et al.
patent: 2006/0145345 (2006-07-01), Choi et al.
patent: 2007/0010064 (2007-01-01), Das et al.

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