Method for manufacturing a semiconductor device including wafer

Fishing – trapping – and vermin destroying

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148DIG162, 324500, 324158R, 324158P, 324158T, H01L 2166

Patent

active

052197654

ABSTRACT:
The present invention provides a method for manufacturing a highly reliable semiconductor device without waste by incorporating predetermined functions into a wafer in a wafer completion process, aging the wafer in a wafer aging process, distinguishing between non-defective and defective chips in a probe inspection process, separating chips in the wafer one by one in a dicing process, sorting out the chips into non-defective and defective chips in a selection process, then analyzing failure information and feeding back the result of the analysis to the wafer completion process in a feedback process, thereby quickly analyzing and repairing a failure process on reliability in the wafer completion process.

REFERENCES:
patent: 4607219 (1986-08-01), Isosaka
patent: 4751656 (1988-06-01), Conti et al.
patent: 4801869 (1989-01-01), Sprogis
patent: 4853628 (1989-08-01), Gouldsberry et al.
patent: 4985988 (1991-01-01), Littlebury

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