Method for manufacturing a semiconductor device, including optic

Details Method for manufacturing a semiconductor device, including optic Method for manufacturing a semiconductor device, including optic

1992-05-04

1993-07-20

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437174, 437942, H01L 21326

Patent

active

052293041

ABSTRACT:
A method for manufacturing a semiconductor device which includes a step of evaluating the dopant profile, in at least the depth dimension, in a processed or partially processed wafer. The evaluation is performed nondestructively, by measuring a differential reflectivity spectrum of the doped portion of the wafer. The resulting spectrum can be related to the Fourier transform of the dopant profile in the depth dimension.

REFERENCES:
patent: 4636088 (1987-01-01), Rosencwaig et al.
patent: 4917462 (1990-04-01), Lewis et al.
patent: 4981815 (1991-01-01), Kakoschke
patent: 5042952 (1991-08-01), Opsal et al.
patent: 5126569 (1992-06-01), Carlson
R. S. Miranda, et al., "Use of time-resolved IR reflection and transmission as a probe of carrier dynamics in semiconductors", Optics Lett. 16, 1991, pp. 1859-1861.

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