Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1985-01-09
1986-03-25
Ozaki, George T.
Metal working
Method of mechanical manufacture
Assembling or joining
148 15, 148187, 29578, H01L 21425
Patent
active
045773971
ABSTRACT:
The present invention provides a semiconductor device which includes a thick countersunk oxide layer selectively formed by the LOCOS process on the surface of a silicon body, openings formed in this oxide layer, and semiconductor element regions formed by the introduction of an impurity in the silicon body through these openings.
The semiconductor element regions preferably comprise the emitter region and the collector region of the lateral transistor.
REFERENCES:
patent: 3971059 (1976-07-01), Dunkley et al.
patent: 4144098 (1979-03-01), Roesner
patent: 4157268 (1979-06-01), Bergeron et al.
patent: 4191595 (1980-03-01), Aomura et al.
patent: 4325180 (1982-04-01), Curran
patent: 4472871 (1984-09-01), Green et al.
Inoue Hiroshi
Komatsu Shigeru
Nakamura Michio
Ozaki George T.
Tokyo Shibaura Denki Kabushiki Kaisha
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