Method for manufacturing a semiconductor device free from electr

Fishing – trapping – and vermin destroying

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437 2, 437 4, 437189, 437225, 437228, H01L 2100, H01L 2102, H01L 2147

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050894269

ABSTRACT:
An improved semiconductor device is disclosed which is free from current leakage due to pin-holes or other gaps. Also an improved method for provessing a semiconductor device is shown. According to the invention, gaps produced in fabricating process of the semiconductor layer are filled with insulator in advance of deposition of electrodes. By virtue of this configuration, short current paths do not result even if transparent electrode is provided on the semiconductor layer.

REFERENCES:
patent: 3290567 (1966-12-01), Gowen
patent: 4542255 (1985-09-01), Tanner et al.
patent: 4543443 (1985-09-01), Moeller et al.
patent: 4584427 (1986-04-01), Mackamul et al.
patent: 4586241 (1986-05-01), Yamazaki
patent: 4624737 (1986-11-01), Shimbo
patent: 4642144 (1987-02-01), Tiedje et al.
patent: 4725558 (1988-02-01), Yamazaki
patent: 4749454 (1988-06-01), Arya et al.
patent: 4764476 (1988-08-01), Yamazaki
patent: 4786607 (1988-11-01), Yamazaki
patent: 4812415 (1989-03-01), Yamazaki
patent: 4937651 (1990-06-01), Yamazaki
Chaudhari, Annealing to fill cracks in thin films, IBM Tech. Discl. Bull., vol. 15, No. 9, Feb. 1973, p. 2697.

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