Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2011-08-09
2011-08-09
Quach, Tuan N. (Department: 2893)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S459000, C438S464000, C257SE21214, C257SE21599
Reexamination Certificate
active
07993974
ABSTRACT:
A method for manufacturing a semiconductor device, includes: preparing a semiconductor substrate with a first notch; preparing a supporting substrate with a second notch; laminating the semiconductor substrate with the supporting substrate so that the first notch can be matched with the second notch; and processing a second main surface of the semiconductor substrate opposite to a first main surface thereof facing to the supporting substrate to reduce a thickness of the semiconductor substrate to a predetermined thickness.
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Dohi Masayuki
Hagiwara Kenichiro
Harada Susumu
Sekiguchi Masahiro
Shirakawa Tatsuhiko
Kabushiki Kaisha Toshiba
Quach Tuan N.
Turocy & Watson LLP
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