Method for manufacturing a semiconductor device

Details Method for manufacturing a semiconductor device Method for manufacturing a semiconductor device

1977-12-22

1979-06-05

Tupman, W.

Metal working

Method of mechanical manufacture

Assembling or joining

29589, 29590, B01J 1700

Patent

active

041569636

ABSTRACT:
A method for manufacturing a semiconductor device having a cathode layer divided into a plurality of mesa type cathode layer portions and used under pressure applied from the cathode layer side through a pressing plate, the method comprising steps of disposing a flat plate having a lateral width covering at least from the outer edge of a cathode electrode disposed on one outermost cathode layer portion to the outer edge of a cathode electrode disposed on the other outermost cathode layer portion, applying an external pressure through the flat plate, and then disposing the pressing plate.

REFERENCES:
patent: 3991461 (1976-11-01), Anderson
patent: 4040085 (1977-08-01), Jouanny
patent: 4068368 (1978-01-01), De Bard

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