Method for manufacturing a semiconductor device

Fishing – trapping – and vermin destroying

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437229, 437245, H01L 21465

Patent

active

050175130

ABSTRACT:
A method for manufacturing a semiconductor device comprises the steps of preparing a body having an insulating layer formed on a silicon substrate, an Al-Si-Cu alloy film formed on the insulating layer and an organic layer mask pattern formed on the alloy film, selectively etching a portion of the alloy film by a reactive ion etching with the mask pattern as a mask, and foreign film being left as a foreign material on a side wall of the alloy film at the step of the selective etching, the foreign material containing constituents of the treating layer and/or the underlying layer, heat-treating the body in an atmosphere containing at least oxygen and ashing the mask pattern while making the foreign film porous, the exposing, subsequent to the heat-treating step, the body to an etching step by an etching solution containing phosphoric acid and hydrofluoric acid.

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patent: 4544416 (1985-10-01), Meador et al.
patent: 4572759 (1986-02-01), Jacob
patent: 4680085 (1987-07-01), Vijan et al.
patent: 4744861 (1988-05-01), Matsunaga et al.
patent: 4867799 (1989-09-01), Grebinski
patent: 4889609 (1989-12-01), Cannella

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