Method for manufacturing a semiconductor device

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437 47, 437 48, 437 60, 437228, 437919, H01L 2170

Patent

active

051322404

ABSTRACT:
A method for manufacturing a semiconductor device including steps of (i) laminating a first insulating film over a semiconductor substrate having a plurality of gate electrodes, on which side walls are at least formed, through capacitor formation regions, removing the first insulating film in the capacitor formation region so as to form a direct contact, and laminating a first conductive film over the semiconductor substrate including the residual first insulating film, (ii) removing the first conductive film with remaining at least in the capacitor formation region, (iii) sequentially laminating over the semiconductor substrate including the residual first conductive film (a) a second insulating film, a second conductive film and a third insulating film, or (b) a second insulating film and a second conductive film, and then laminating a resist layer over the whole surface, and (iv) patterning the resist layer and removing with the use of a resist pattern (a) the third insulating film, second conductive film, second insulating film and first conductive film, or (b) the second conductive film, second insulating film and first conductive film, so that the capacitor electrodes of a FEC type DRAM cell including a capacitor upper electrode, a capacitor insulating film and a capacitor lower electrode can be formed in the capacitor formation region.

REFERENCES:
patent: 4355374 (1982-10-01), Sakai et al.
patent: 4742018 (1988-05-01), Kimura et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for manufacturing a semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing a semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing a semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-842896

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.